Phone CPU BGA Reballing Stencil Reball Rework Template Screen for Samsung C7010 J610

Feature: 1. Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likley to deform under high temperature. 2. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3. Perfect Fitting: Allows for wide application on for C7010, J610 series, and the BGA remplate is also universal for A7, A5, A3, S5, J7 series. 4. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5. Simple Carrying: Compact in size and light in weight as well, the phone CPU rework stencil is very convenient to carry, and simple to work on. Specification: Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For MSN8916, MSN8953 CPU. Applicable Product Model: For C7010, J610 series, universal for C7, J3, J5, A5, etc. . Package List: 1 x Phone CPU BGA Reballing Stencil