Tin Solder Without Flux For Copper Installations Fi 3.00 250G Pcs - C-D6 3 250

Technical data: Wire diameter: 3.0 Capacity [g]: 250 Lead-free tin-based soldering alloys are mainly used in electronics, electrical engineering, and construction. These are most often Sn-Ag-Cu, Sn-Cu and Sn-Ag alloys with alloying element contents of up to several%. These alloys are most often used where the presence of lead in the solder is undesirable or prohibited. In construction, the Sn97Cu3 solder is most often used for soldering copper installations. Physicochemical properties Lead-free solders ensure good weld quality. These alloys are characterized by a melting point slightly higher, by approximately 30°C, and slightly poorer wetting of soldered surfaces than Sn-Pb alloys. However, the use of appropriate fluxes significantly improves the soldering process and weld quality. Silver as an alloying element in lead-free solders increases the wetting rate and improves resistance to thermal fatigue. The addition of Cu improves the soldering of electrical connections. ** Illustrative photo