4 in 1 Soldering Lugs+Sand Papper+Needle Welding Set Solder Piece Rework Pad Welding Point for Phone Repair IC Pad Touch BGA PCB

Department : Unisex-adult Pattern : Others High-concerned chemical : none Material : Stainless Steel Type : Combination Application : Computer Tool Kit Origin : Mainland China Model Number : BST-66 Size : 48 x 67 mm Brand Name : BES is_d : No DIY Supplies : Phone Repair Package : Bag Type 1 : 4 in 1 Jump Wire Patching Tools Type 2 : Rework Pad Soldering Lug Type 3 : 2nd Generation Rework Pad Type 4 : Soldering lug for pads repair Function : For Fixing Soldering Spot Function 2 : For BGA chip Welding Repair,Motherboard IC Repair Feature 1 : Soldering Lug Feature 2 : Ultra thin experience Feature 3 : Fixed pin of pad Batch Pin Diameter : 0.01mm Specifications : 2635 points/sheet Sandpaper : about 50 x 50 mm

Features:

1.Replace the tradional circling of jump wire to filled the missing solder joint ,restore to the original pad and without trace 2.The pads are reinforced with fixed pins and will never fall off 3.It adopts industrial-grade printed circuit board copper foil with a thickness of 30μm 4.Good flatness,which can prevent pseudo soldering effectively caused by unevenness 5.The connection joint with the circuit is firm ,and can fixed the green oil(UV curing solder mask ink)well 6.It saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high 7.The BGA bonding surface has saturation ,stable electrical performance ,good welding strength ,and it is not easy to drop off and unsoldering.

Applicable:

Applicable for dot-faded soldering pad with various shapes and models of soldering lug Applicable for beauty the pad with seamless repairing

Use:

Effect After Repairing Curling the wires to make jumper wires is no longer needed. After pads soldering, the double-layered motherboard can be installed to the testing fixture or recombined directly. Repair efficiency will be tremendously increased. label:yes