Phone CPU BGA Reballing Stencil Reball Rework Template Screen for IPhone 11 Pro Max

Feature: 1. Quick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. 2. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. 3. Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful. 4. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. 5. Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it. Specification: Item Type: Phone CPU BGA Reballing Stencil Product Material: Stainless Steel Spacing: 0.12mm Applicable CPU: For A13 Applicable Product Models: For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max. . Package List: 1 x Phone CPU BGA Reballing StencilQuick in Tinning: Fast in tinning speed and accurate in positioning, the BGA reballing stencil is not likely to deform under high temperature. Safe for IC Chip: The IC slots on the main body can effectively prevent small IC tin from sticking and prevent small IC from breaking corners. Perfect Fitting: Allows for wide application on for A13 CPU as well as for For iPhone 11, for iPhone 11 Pro, for iPhone 11 Pro Max, very useful. Stainless Steel: The premium stainless steel material with standard design has a sturdy structure, which is very durable for long term using. Simple Carrying: Compact in size and light in weight, the phone CPU rework stencil is very convenient to carry, and very simple to work on it.