[Product Description]
Enhanced sound absorption with high-profile processing of the height difference.
● Soft sponge with a height difference of 10mm recessed and 45mm protruding, applied to door trims and pillar covers to absorb unwanted noise without the need for attachment.
● Firmly attached with strong adhesive for long-term use.
● Material: Polyethylene foam
● Weight: approximately 9g per piece
● External dimensions: 60×200mm, with a 10mm recessed and 45mm protruding thickness
[Important Notice - For Overseas Customers]
Thank you for purchasing this product. Before using it overseas, please carefully read the following important notices.
1. Laws, Regulations, and Safety Standards
This product complies with Japanese safety standards. Before use in your country, please check its compliance with local laws, regulations, and safety standards.
Certain product categories (electronics, cosmetics, food, etc.) may require certification in the importing country.
2. Regarding Electrical Products
【Voltage Compatibility】
When using electrical products, please note that they are designed to match Japanese voltage specifications (90-110V). Using them with a different voltage may cause malfunction.
【Plug Type】
Our products use Japanese plug types (Type A or Type B).
Please use a conversion adapter as needed.
【Important Notes Regarding Transformers and Adapters】
Transformers adjust the voltage to match the requirements of the equipment.
Conversion adapters only change the plug shape and do not adjust the voltage.
Using only a conversion adapter without a transformer may damage the product.
[Regarding Liability]
We are not responsible for any malfunctions or damage caused by improper use, such as operating the product without a transformer.
3. Language and Manual
Product instructions and displays may be in Japanese only.
An English version of the manual can be downloaded from our website.
4. Regarding Product Returns and Exchanges
Please note that if you wish to return or exchange a product, you will be required to submit a video of the unpacking process.
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